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Thermal conductive adhesive tape

Thermal conductive adhesive tape Thermal conductive adhesive tape

Structure

Features

1, high thermal conductive and insulating materials, easy to use, the most ideal material for the assembly of uneven surface mechanism; 
2, excellent softness, conformability, self-adhesive and high compression ratio, especially from Viscosity makes the assembly of the production line easier; 
3, applicable to the wide range of ambient temperature, can effectively overcome a variety of harsh environments, can fill the uneven surface, and fully export the heat source on the electronic components; 
4, can be effective at the same time Solve the customer's problems about Thermal Conduct, insulation and balance; 
5, on the fixed heat sink and chipset or soft board, with instant adhesion, insulation, low outgassing and high thermal conductivity.

Product Usage

1, fixed CPU and heat sink or heat sink; 
2, fixed LED substrate and frame; 
3, fixed electronic components and heat sink; 
4, peripheral products for mobile phone battery

Product performance

Serial number Product Model Colour Filler Thickness 
(mm)
density Thermal conductive coefficient 180° peel force 
(gf/25mm)
Stickiness 
(h)
1 F8013WP white glass fiber 0.13 1.5 ≥0.40 1500 >24
2 F8020WP white glass fiber 0.20 1.5 ≥0.40 1500 >24
3 F8025WP white glass fiber 0.25 1.5 ≥0.40 1500 >24

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